Additive Manufacturing Users Group Announces 2016 Conference Keynoters

Additive Manufacturing Users Group Announces 2016 Conference Keynoters

The Additive Manufacturing Users Group (AMUG) has stated its featured keynote speakers for the organization’s annual AMUG Education & Training Conference in St. Louis this April. The lineup includes Todd Grimm, Jason Lopes and Paul Litchfield.

Todd Grimm, president of T. A. Grimm & Associates and AMUG’s AM industry advisor, will open the conference on Monday, April 4. His presentation, titled “The Age of Innovation,” will disclose current and future trends, as well as recent product introductions. Grimm says that he will discuss these developments while offering guidance that will help attendees create strategic and tactical action plans.

Jason Lopes of Legacy Effects, returns for his fourth AMUG keynote appearance. Lopes, who is also speaking on Monday, April 4, has been a sensation with his visual journeys of the special effects the studio has worked on that have used additive manufacturing. In his presentation, he will share the tools he has used, the creativity employed and the amazing results that were achieved.

Paul Litchfield opens the final day of the conference with “The Legacy of Reebok Innovation in Partnership with Additive Manufacturing,” giving attendees insight into Reebok Advanced Concepts’ operations.

The conference includes the Innovators’ Showcase, an on-stage conversation with Scott Crump, Stratasys co-founder and chief innovation officer.

“We are very pleased that Jason Lopes and Todd Grimm have once again agreed to share their views and experiences at the AMUG Conference. Both of these men are perennial favorites of our attendees due to their insights and inspirational speaking styles. We are also excited to have Paul Litchfield, the man behind the Reebok Pump and a driving force for additive manufacturing, appear at our conference for the first time. He has some great stories and insights to share,” says Mark Barfoot, president of AMUG.

For more information, visit the Additive Manufacturing Users Group.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Mentor Graphics Announces Don Miller Award Winners

Mentor Graphics Announces Don Miller Award Winners

Mentor Graphics, a provider of electronic software design solutions, has recognized the winners of its first Don Miller Award for Excellence in System-Level Thermo-Fluid Design. The company established the award to recognize applications of Flowmaster software in research and real-world applications.

This year’s winners were Andrea Tradii, Stefano Rossin and Reccardo De Paolis of GE Oil & Gas. Their work, “Experimental Validation of Steam Turbine Control Oil Actuation Systems Transient Behavior,” was presented at the 2014 International CAE Conference. According to a company press release, it demonstrates the value of simulating the multiphysics of the fluid-mechanical interactions of a steam turbine trip valve with Flowmaster.

The runners-up were from Flow Design Bureau AS and Florence University. At Flow Design, a team investigated the use of 1D and 3D CFD (computational fluid dynamics) as complementary simulation methods and optimized piping systems. Florence University was recognized for its work on understanding interactions between fluid, mechanical control and control logic of a steam turbine control valve.

“I am deeply honored to have an award in my name, and to see the tremendous body of work executed by these outstanding engineers,” stated Don Miller, former research director for BHR Group. “I had no idea the capabilities Flowmaster would provide users with when I sought venture capital funding 35 years ago. The prize-winning entry clearly demonstrates that from a core of validated data, not only can the thermal/fluid flow performance of complete systems be simulated, but also the functioning of complex individual components that carry out vital control and safety functions.”

For more information, visit Mentor Graphics.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

UberCloud Announces Container Technology Release

UberCloud Announces Container Technology Release

UberCloud, a provider of high-performance computing cloud resources, has partnered with Univa to release UberCloud containers. These containers, the company states, are ready-to-execute packages of software designed to deliver essential tools to engineers for the task at hand. They are also available to instantly launch on the cloud and offer commercial as well as open-source technical applications.

The partnership between UberCloud and Univa, a press release states, aims to provide an orchestration environment and eventually offer containers from ANSYS, CD-adapco, Gromacs, Numeca, OpenFOAM and more. In September, Univa announced its Grid Engine Container Edition enterprise workload management software that enables container usage and implementation.

“Container’s best-selling point, in my opinion, is the fact that I don’t have to change my ‘routines’ to set up a simulation and solve it. Using the container is as if I’m logging onto just another local network machine via remote desktop,” said Mio Suzuki, analysis engineer at Trek Bicycle Corporation. “This is great especially for engineers like me with short project turnaround times restricting the ability to spend time to modify my working patterns or investigate in the new setup even when the ‘new way of doing’ may become beneficial in the long run.”

“Application containers bring a simplicity to complex performance and engineering environments never seen before,” said Wolfgang Gentzsch, president of UberCloud. “UberCloud builds powerful engineering and scientific software application containers as a professional service and in partnership with leading software providers. UberCloud and Univa technologies complement each other with Univa focusing on orchestrating jobs and containers on any computing resource infrastructure.”

For more information, visit UberCloud.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Alan Alda to Open SC15 Conference

Alan Alda to Open SC15 Conference

Alan Alda

Noted science communicator and award-winning actor Alan Alda will discuss the role of science in our society and the intersection of science and computing as he delivers the SC15 keynote address Nov. 17, 2015 in Austin, TX.

“High performance computing has a transformational impact on science in our society,” says SC15 general chair Jackie Kern, University of Illinois at Urbana Champaign. “For decades scientists and engineers have relied on high performance computing to advance the state of the art in diverse fields ranging from healthcare and automotive safety to renewable energy. Computing is now fully integrated into the scientific discovery process, an equal partner with theory and experiment in improving the quality of life for all members of our global society. Mr. Alda’s focus on communicating the benefits of science to the public — and how we can all do this more effectively — makes him uniquely positioned to help SC continue to bridge the gaps in science understanding and highlight our role in the discovery process.”

Alda, an actor, writer, science advocate and Visiting Professor at Stony Brook University, will share his passion for science communication and its importance, drawing on his personal experiences including 11 years hosting the TV series Scientific American Frontiers. Throughout his 40-year career, he has won seven Emmys, six Golden Globes and three Directors Guild of America awards for directing. Alda also hosted the 2010 PBS mini-series The Human Spark and wrote Radiance: The Passion of Marie Curie, a play about the personal life of the great scientist who discovered radium. He teamed up with PBS again in 2013 for Brains on Trial, a neurological look at brains in the court room.

Alan Alda addressing the World Science Festival. He is a member of its Board of Directors. Image courtesy of the World Science Festival.

A recipient of the National Science Board’s Public Service Award, Alda is a visiting professor at — and founding member of — Stony Brook University’s Alan Alda Center for Communicating Science, where he helps develop programs on how scientists communicate with the public. He is also on the Board of Directors of the World Science Festival.

For more information, visit the SC15 site.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

3M Novec 7100 Fluid Used in Large Two-Phase Immersion Cooling Project

3M Novec 7100 Fluid Used in Large Two-Phase Immersion Cooling Project

What’s being billed as the world’s most powerful two-phase immersion cooling (2PIC) project will be deployed in a 40+ MW data center being constructed by BitFury Group in the Republic of Georgia. Designed and built by the Hong Kong-based engineering company, Allied Control, the 2PIC project will use 3M Novec 7100 Engineered Fluid, an immersion coolant with a low global warming potential, according to 3M. Allied Control is a pioneer in 2PIC, a field showing promise in boosting data center efficiency.

BitFury’s immersion cooling system using 3M Novec Engineered Fluid. Image courtesy of BitFury.

Allied Control was recently acquired by BitFury Group, a Bitcoin Blockchain infrastructure provider and transaction processing company, which builds its own fully custom application specific integrated circuits (ASICs), printed circuit boards (PCBs), servers and data centers. BitFury uses renewable energy for all of its business operations. 3M says BitFury will leverage Allied Control’s 2PIC technology with Novec fluid in the Georgia data center to deploy 28nm and 16nm ASICs more efficiently, saving energy and lowering operational costs while meeting goals of net carbon neutrality.

“With 250 KW per rack and not having reached the limits yet, we now have the ability to grow quickly and spread the cost of the cooling system over many hardware generations,” said Kar-Wing Lau, vice president of operations at Allied Control.

Graphic courtesy of 3M.

2PIC involves placing hardware in an accessible tank of fluid coolant with a low boiling point, such as Novec 7100 fluid (61°C/142°F). As the hardware heats up in the tank, it boils the Novec fluid, and this change in state pulls the heat away from the components. The Novec fluid becomes a vapor, rises, condenses on a water-cooled condenser coil and falls back into the tank without the use of pumps. The streamlined system can deliver as much as 95% cooling energy savings with minimal fluid loss, according to 3M.

“The PUE we’ve achieved leads us to the next level of data center cooling for high performance computing,” said Valery Vavilov, BitFury CEO. “We’ve taken many steps to optimize our infrastructure for securing the blockchain and blockchain transaction processing that have led us to many different technological innovations. These experiences and technologies could be useful for next generation data center constructions of high performance computing and supercomputing.”

Phase 1 of this project will include 40MW of IT load running at 1.02 PUE with plans for further expansion in the near future. News of the project comes ahead of the 2015 Supercomputing Conference (SC15) in Austin, TX, where 3M will have a demonstration tank of 2PIC with Novec 7100 fluid on display in booth #2710.

For more information, visit 3M.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Materialise and Additive Industries Partner for Industrial 3D Printing Applications

Materialise and Additive Industries Partner for Industrial 3D Printing Applications

Materialise NV, a provider of additive manufacturing software and 3D printing solutions in the medical and industrial markets, has entered into a development partnership with Additive Industries, a Dutch company specializing in metal additive manufacturing equipment for industrial applications.

Materialise is building partnerships with machine manufacturers to bridge the gap between 3D software and a range of 3D printers. Additive Industries is a new player in the additive manufacturing market will offer a modular 3D metal printing system to industrial markets.

This month, Additive Industries’ team is launching its own integrated metal additive manufacturing system, the MetalFAB1. Equipped with automated build plate handling and in-line heat treatment, MetalFAB1 will premiere at FormNext, an international exhibition and conference on additive technologies and tool making. FormNext will take place between November 17-20 in Frankfurt am Main (D).

The partnership with Materialise is to develop a customized version of Build Processor software. The Additive Industries Build Processor is intended to simplify the 3D printing process for everyone with a MetalFAB1 machine. The software will facilitate the communication of data to the machine and will provide users with an overview of their print jobs. Its slicing algorithm can help users handle large design files.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

For more information, visit Additive Industries, Materialise andFormNext.

Intersil Releases Time-of-Flight Integrated Circuit

Intersil Releases Time-of-Flight Integrated Circuit

Intersil Corporation, a provider of power management and precision analog solutions, has introduced a ToF (time-of-flight) signal processing IC (integrated circuit) that provides a complete object detection and distance measurement solution. The ISL29501 ToF offers ultra-small size, low power consumption and connectivity for such applications as Internet of Things devices, consumer mobiles and commercial drones.

The IC, according to Intersil, overcomes the challenges of traditional amplitude-based proximity sensors and other ToF that perform poorly in lighting conditions above 2,000 lux, or cannot always provide distance information. It also has an on-chip emitter DAC with programmable current up to 255mA and desired level selection for the infrared laser. This technology also uses the company’s power management expertise to save power and extend battery life, a press release states.

“Prior to Intersil’s time-of-flight technology breakthrough, there was no practical way to measure distance up to two meters in a small form factor,” said Andrew Cowell, senior vice president of Mobile Power Products at Intersil. “The innovative ISL29501 provides customers a cost-effective, small footprint solution that also gives them the flexibility to use multiple devices to increase the field of view to a full 360 degrees for enhanced object detection capabilities.”

For more information, visit Intersil.

Sources: Press materials received from the company and additional information gleaned from the company’s website.