Arrow Electronics Expands Portfolio

Arrow Electronics Expands Portfolio

Arrow Electronics has expanded its portfolio to offer sensor products and solutions from TE Connectivity. Arrow now provides TE’s range of sensors, from humidity, pressure, temperature and position sensors.

“We are excited about expanding our sensor portfolio with Arrow Electronics,” said John Tuley, director, global accounts, TE Connectivity. “Arrow’s global field organization will be able to support our customers’ design-in needs globally, as well as provide supply chain solutions to help support our sensor customers’ needs from design to production. We expect this expanded partnership to enable TE to reach emerging companies in the Internet of Things (IoT) market as well as grow the industrial, medical and transportation business for both of our companies.“

For more information, visit Arrow Electronics.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Additive Manufacturing Users Group Opens Scholarship Nominations

Additive Manufacturing Users Group Opens Scholarship Nominations

The Additive Manufacturing Users Group (AMUG) is now accepting applications for its two annual scholarships for AM education and professional development at its annual conference. The scholarships have been established in the memory of Guy Bourdeau and Randy Stevens, two longtime supports of the users group that were passionate about knowledge sharing in the additive manufacturing industry, the organization states.

The scholarships are awarded to one student and an educator who would not be able to attend the group’s annual conference otherwise. The Guy E. Bordeau scholarship is granted to a student of any major or field who can demonstrate the integration of 3D printing into their profession. The Randy Stevens scholarship is for any educator that emphasizes or focuses on additive manufacturing in their curriculum.

“The AMUG conference was an event that left memories I will hold on to in my professional life. Coming from an academic background, I viewed the AMUG Conference as a potential bridge to take me towards collaboration and involvement with AM technology in industry, and I would say that this happened,” said Yaser Shanjani, 2015 recipient of the Guy E. Bordeau scholarship.

“These scholarships embody Guy’s and Randy’s spirit and passion for additive manufacturing, and they continue the legacy of two giving gentlemen,” says Mark Barfoot, president of AMUG.

Applications are being accepted until February 15, 2016.

For more information, visit AMUG.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Razorleaf Introduces Clover

Razorleaf Introduces Clover

Razorleaf Corporation has introduced Clover, a new open integration platform designed to support implementation, migration or upgrades of PLM (product lifecycle management) applications and databases. Clover’s capabilities exchange data with systems outside of PLM such as ERP, MES, 3D hardware, industrial automation and CMS using open interface protocols.

The platform operates using industry standard connection methods including SOAP, Web services and direct database connections. Third-party microservices lets users move files, renditions and business data in the correct format. It can be paired 1:1 or 1:many endpoints, offering scalability, the company states.

“The Clover platform is a result of our long-standing experience in creating CAD/CAM/PLM integration endpoints,” stated Eric Doubell, CEO of Razorleaf Corporation. “We now have created an industry standard application integration platform that has a flexible architecture and can scale easily based on its endpoint applications. This platform helps our customers retain the feature sets they have come to rely upon in their application investments and allow for a more controlled migration path forward when upgrading is a requirement. Making up-to-date data available across applications accelerates decision-making and process efficiency across the organization.”

For more information, visit Razorleaf.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Dell Expands HPC Industry Offerings

Dell Expands HPC Industry Offerings

Dell has advanced its HPC (high-performance computing) portfolio. This includes new systems, the Intel Omni-Path Fabric and expansions to its HPC Innovation Lab.

The new HPC System Portfolio from Dell is a family of HPC and data analytics solutions that includes:

  • HPC System for Geonomic Data Analysis is designed to meet the needs of genomic research organizations. Dell’s relationship with the Transitional Genomics Research Institute (TGen) has helped create a solution for identifying treatments in clinically relevant timeframes.
  • HPC System for Manufacturing lets users running manufacturing design simulations using workstations, clusters or a hybrid environment. Use cases can be seen for finite element analysis or computational fluid dynamics with softwares from ANSYS and CD-adapco.
  • HPC System for Research is a baseline architecture for applications involving complex scientific analysis.

Dell has also entered a new partnership with Intel as part of the Intel Fabric Builders program. This collaboration is working to support and expand the Intel Scalable System Framework, which offers Omni-Path Fabric technology, next-generation Intel Xeon Processors and the Intel Enterprise Edition for Lustre.

“HPC is no longer a tool only for the most sophisticated researchers. We’re taking what we’ve learned from working with some of the most advanced, sophisticated universities and research institutions and customizing that for delivery to mainstream enterprises,” said Jim Ganthier, vice president and general manager, Engineered Solutions and Cloud, Dell. “As the leading provider of systems in this space, Dell continues to break down barriers and democratize HPC. We’re seeing customers in even more industry verticals embrace its power.”

For more information, visit Dell.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

COMSOL Releases Multiphysics 5.2

COMSOL Releases Multiphysics 5.2

COMSOL has officially released Multiphysics 5.2, with the updated Application Builder and Server. This version, according to the company, delivers new features for improved stability, robustness and faster execution.

Caching capabilities are available for faster app startup times, and administrators can have specific apps start running when a user logs into the Server.

The new apps in the COMSOL Application Library are for industries such as water treatment, thermoelectric cooling, heat exchangers, touchscreen design, magnetic prospecting, piezoacoustic transducers, muffler design, MEMS sensors and pressure vessels.

A new Mesh Parts function has been added to make it easier to import surface and volume meshes for use in geometry building. Annotation plots let users display customized text in 2D and 3D plots. The company notes that it has also added a host of user-requested features.

“With version 5.2 we ship about 50 apps demonstrating the depth and power of the Application Builder and the COMSOL Server,” said Svante Littmarck, CEO of COMSOL. “These apps are meant to provide COMSOL users with examples that can be easily inspected, edited, and used as a starting point for their own applications. We had a lot of fun building these apps and love the new Application Builder functionality! For example, if we take a look at the Mixer app, which ships with the Mixer Module, we are presented with a sophisticated application that can be used to simulate almost any type of mixer without requiring expertise in differential equations or CFD (computational fluid dynamics). This takes modeling and simulation to a whole new level.”

For more information, visit COMSOL.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Actran 16 Released

Actran 16 Released

Free Field Technologies has released Actran 16. The new version includes tools for performance in acoustic, vibro-acoustic and aeroacoustic simulations. Ease-of-use enhancements have also been added, the company states.

Acoustic propagations in huge domains and at high frequencies are now possible with Actran DGM code that supports GPU (graphics processing unit) acceleration.

For aeroacoustic capabilities, Actran 16 has the new SNGR module that synthesizes noise from inexpensive steady RANS solutions. Pellicular mode decomposition is also integrated for automotive side-window analysis and other acoustic contributions on non-rectangular and non-planar solutions.

The Actran time domain solver has been enhanced with solution capabilities and integration with MSC Software codes. Now, the software can read Dytran output files and has an updated interface with Adams.

Ease-of-use updates include several new tools for rapid creation and manipulation of vibro-acoustic meshes. Adaptive meshing technology has also been extended.

“Actran 16 delivers a valuable set of features to the industry,” said Benoit Van den Nieuwenhof, CTO at FFT. “The SNGR feature gives users access to new capabilities like full car exterior aero-acoustics where unsteady CFD computations are not affordable. For tackling higher frequencies and their associated model sizes, Actran features an original and automated mesh adaptivity. The Actran DGM solver leverages the latest HPC environments such as GP-GPUs which dramatically improves the computational efficiency of acoustic radiation analyses for automotive and aerospace industries”.

For more information, visit Free Field Technologies.

ZWSoft, Autodesk Enter Lawsuit Settlement

ZWSoft, Autodesk Enter Lawsuit Settlement

ZWSoft and Autodesk have entered a settlement regarding lawsuits pending in the Hague and the U.S. District Court of California. In 2014, Autodesk had filed a suit alleging that the AutoCAD source code had been misappropriated and improperly used when developing ZWCAD+, the company states.

Subsequent investigation revealed that a ZWSoft employee, had in fact, improperly used AutoCAD intellectual property (IP) when developing ZWCAD+ and did not inform the company’s management team. Upon conclusion, ZWSoft has stopped selling ZWCAD+ in all markets.

End users of ZWCAD+ may contact ZWSoft for a replacement version of ZWCAD Classic.

“We respect every company’s IP very much, and we do not condone these behaviors at ZWSoft. We have stopped selling ZWCAD+ in all markets, and we retract all prior statements suggesting that Autodesk’s lawsuits lack merit and were brought for anti-competitive purposes. We sincerely apologize to Autodesk for the inconvenience that our actions have caused. We appreciate very much Autodesk’s professionalism and understanding during the investigation, as well as its encouragement of fair competition. We will enhance our internal management to prevent any intellectual property infringement in the future by instituting additional development safeguards,” said Truman Du, CEO at ZWSoft.

For more information, visit Virtual Desktop and Autodesk.

Sources: Press materials received from the company and additional information gleaned from the company’s website.