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University of Vienna Updates VASP

University of Vienna Updates VASP

The University of Vienna has developed the VASP (Vienna Ab Initio Simulation Program) for atomic-level analysis of electronics, glass, rubber, catalysts, magnetic materials and more. This version of the program is run on the Tesla Accelerated Computing Platform, offering speed improvements from 2.5 to 4x faster, the university states.

VASP helps researchers understand the underlying structure of a material and its properties. It comprises up to 15% of computing cycles across major supercomputers worldwide.

For this speed improvements, VASP developers collaborated with several university to release version 5.4.1 with support for GPU (graphics processing unit) accelerators before the end of this year. The application can now use NVIDIA K80 accelerators to advance research.

For more information, visit the University of Vienna.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Aras, T-Systems Partner

Aras, T-Systems Partner

Aras, a provider of PLM (product lifecycle management) software, has partnered with T-Systems to launch a PLM Cloud Platform Software-as-a-Service. Running on a secure infrastructure, the T-System PLM Cloud Platform offers end-to-end services with full Aras Innovator functionality, customization and integration capabilities, a company press release states.

The Cloud Platform is predefined for SMBs (small-to-midsize businesses) as well as large enterprises, has full customization capabilities, open integration and data federation functions and a PDMWebConnection for integration to Enovia, Teamcenter and Windchill. PDMWorkbench integrations to CATIA and NX are also available for design data.

“We’re excited that T-Systems has selected Aras as the PLM backbone for their new PLM Cloud Platform,” said Peter Schroer, CEO of Aras. “By partnering with T-Systems on this SaaS offering, we are able to deliver a complete cloud solution that provides all the power Aras Innovator offers, together with integrated services and expert support.”

For more information, visit Aras.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

CIMdata Announces PLM Road Map Event

CIMdata Announces PLM Road Map Event

CIMdata has announced its PLM (product lifecycle management) Road Map event for the high tech and medical device communities. This year’s event will take place on May 24 in Santa Clara, CA. According to the company, these events bring together leading industry experts from CIMdata, key industry players and front-line implementation experts to explore end users’ progress, opportunities and road blocks.

The theme for the May event is “Innovation and Structure – Where Processes and Tools Collide.” Presentations at this event will explore these challenges and others including: impacts that often result in design delays and subpar product innovation when innovation must accelerate in this increasingly complex environment, and how PLM can and should play a key role in enabling innovation while enforcing process discipline and structure.

“2015 turned out to be a revitalization of innovation as business offerings were redefined based upon leveraging electronics and the Internet of Things. Increasingly, multidisciplinary perspectives are reshaping our understanding of what defines products. The challenge ahead is how to make increasingly complex offerings sustainable.”

For more information, visit CIMdata.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Luxion, Onshape Partner for KeyShot Connection

Luxion, Onshape Partner for KeyShot Connection

Luxion, a provider of rendering and lighting technology, has released the KeyShot Connection for Onshape. This plug-in lets users make photorealistic renderings and animations of their Onshape documents.

The integration enables users to connect to their Onshape account from inside KeyShot, share Onshape documents with any changes and update files without losing any material, lighting or animations set up in KeyShot.

To access the capability within KeyShot, an option for “Connect to Onshape” is added to the menu after installation. While browsing, Part Studio or Assembly is selected and brought into KeyShot with the click of a button, with the model structure, part and assembly names all maintained. (KeyShot Pro adds the ability to import NURBS data for perfectly smooth, rounded surfaces.) After materials, environments and textures are added in KeyShot, the scene may be saved and uploaded directly to an Onshape Document for others to make updates.

“With the growth of Onshape and request for Onshape support from KeyShot users, we are pleased to partner with them for the introduction of the Onshape App Store,” says Thomas Teger, VP of Products and Strategy at Luxion. “This confirms with us that more 3D professionals are interested in mobile solutions with the ability to create high-quality visuals of their 3D data quickly.”

For more information, visit Luxion and Onshape.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

BigLever Software Announces Next-Generation Gears

BigLever Software Announces Next-Generation Gears

BigLever Software, a provider of Product Line Engineering (PLE) solutions, has released the next generation of its Gears PLE Lifecycle Framework. New capabilities, according to the company, help reduce product complexity, increase efficiency, interoperability and alignment of all aspects of designing, delivering, maintaining and evolving a product line.

The next-generation includes two new significant capabilities for enterprise operation: Feature Bundles and Views.

With Feature Bundles, other departments beyond engineering can understand product line features and complete product line portfolio management.

The Views capability supports Feature Bundles and lets users focus on a selected set of product feature definition tasks within a larger context.

“As manufacturers are challenged to deliver sophisticated product lines with more feature diversity, they are looking for ways to dramatically reduce engineering and operational complexity,” said Dr. Charles Krueger, BigLever Software CEO. “The new Gears capabilities represent a transformative shift. By achieving better alignment between engineering and enterprise operations, organizations are able to manage product complexity and variability much more effectively – from product line portfolio planning to engineering, manufacturing, sales, and maintenance. The result is whole-factor improvements in time-to-market, product line scalability, and product quality – which translate to major gains in competitive advantage.”

For more information, visit BigLever Software.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Mentor Graphics Updates FloTHERM

Mentor Graphics Updates FloTHERM

Mentor Graphics has released the latest version of its FloTHERM product. This iteration of the CFD (computational fluid dynamics) software has automated simulation model calibration for matching of transient thermal measurements from T3Ster. By doing so, the company states, users can maximize simulation data accuracy and provide insight into product reliability.

The T3Ster is an advanced thermal tester for characterization of IC (integrated circuit) packages, LEDs and systems that produce rapid thermal characteristics. This release can convert a simulated transient thermal response into a structure function curve.

“By using an uncalibrated model for simulation, manufacturers run the risk of simply guessing performance. Calibrating the package model constants ensures the product will respond accurately in all steady state and transient applications” stated Roland Feldhinkel, general manager of Mentor Graphics Mechanical Analysis Division. “We continue to invest in leading simulation and measurement technologies to provide our customers with superior and productive capabilities to handle their most complex thermal management challenges.”

For more information, visit Mentor Graphics.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Digi-Key Surpasses 50 Million Shipments

Digi-Key Surpasses 50 Million Shipments

Digi-Key, a provider of electronic components, has surpassed its shipping milestone of over 50 million packages. To celebrate this, the company has been featuring key customers throughout world regions. One of these companies is Plexus.

Plexius is a provider of electronics design, manufacturing and aftermarket services to companies with mid-to-low volume, higher complexity products.

“Digi-Key has been serving electronic design engineers and ‘Makers’ in our industry before they were even called ‘Makers’ since our very beginning in 1972,” says to Dave Doherty, president. “So recognizing this milestone of shipping our 50,000,000th package was something we wanted to celebrate. But we also wanted to recognize our customers who have driven our success; and not just a single customer, because we do business with well over 400,000 different companies each year.”

For more information, visit Digi-Key.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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