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Dell Expands HPC Industry Offerings

Dell Expands HPC Industry Offerings

Dell has advanced its HPC (high-performance computing) portfolio. This includes new systems, the Intel Omni-Path Fabric and expansions to its HPC Innovation Lab.

The new HPC System Portfolio from Dell is a family of HPC and data analytics solutions that includes:

  • HPC System for Geonomic Data Analysis is designed to meet the needs of genomic research organizations. Dell’s relationship with the Transitional Genomics Research Institute (TGen) has helped create a solution for identifying treatments in clinically relevant timeframes.
  • HPC System for Manufacturing lets users running manufacturing design simulations using workstations, clusters or a hybrid environment. Use cases can be seen for finite element analysis or computational fluid dynamics with softwares from ANSYS and CD-adapco.
  • HPC System for Research is a baseline architecture for applications involving complex scientific analysis.

Dell has also entered a new partnership with Intel as part of the Intel Fabric Builders program. This collaboration is working to support and expand the Intel Scalable System Framework, which offers Omni-Path Fabric technology, next-generation Intel Xeon Processors and the Intel Enterprise Edition for Lustre.

“HPC is no longer a tool only for the most sophisticated researchers. We’re taking what we’ve learned from working with some of the most advanced, sophisticated universities and research institutions and customizing that for delivery to mainstream enterprises,” said Jim Ganthier, vice president and general manager, Engineered Solutions and Cloud, Dell. “As the leading provider of systems in this space, Dell continues to break down barriers and democratize HPC. We’re seeing customers in even more industry verticals embrace its power.”

For more information, visit Dell.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

COMSOL Releases Multiphysics 5.2

COMSOL Releases Multiphysics 5.2

COMSOL has officially released Multiphysics 5.2, with the updated Application Builder and Server. This version, according to the company, delivers new features for improved stability, robustness and faster execution.

Caching capabilities are available for faster app startup times, and administrators can have specific apps start running when a user logs into the Server.

The new apps in the COMSOL Application Library are for industries such as water treatment, thermoelectric cooling, heat exchangers, touchscreen design, magnetic prospecting, piezoacoustic transducers, muffler design, MEMS sensors and pressure vessels.

A new Mesh Parts function has been added to make it easier to import surface and volume meshes for use in geometry building. Annotation plots let users display customized text in 2D and 3D plots. The company notes that it has also added a host of user-requested features.

“With version 5.2 we ship about 50 apps demonstrating the depth and power of the Application Builder and the COMSOL Server,” said Svante Littmarck, CEO of COMSOL. “These apps are meant to provide COMSOL users with examples that can be easily inspected, edited, and used as a starting point for their own applications. We had a lot of fun building these apps and love the new Application Builder functionality! For example, if we take a look at the Mixer app, which ships with the Mixer Module, we are presented with a sophisticated application that can be used to simulate almost any type of mixer without requiring expertise in differential equations or CFD (computational fluid dynamics). This takes modeling and simulation to a whole new level.”

For more information, visit COMSOL.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Noesis Solutions Releases Optimus 10.17

Noesis Solutions Releases Optimus 10.17

Noesis Solutions has released Optimus 10.17, extending capabilities for simulation-based engineering. This release has multiple new software integrations and interfaces.

The new included interfaces are built on Optimus’ UCI/UCA infrastructure. This lets users connect with legacy and in-house simulation tools within a single workflow.

The new direct interface for CETOL 6? supports the efficient optimization of engineering challenges involving mechanical tolerance analysis. Product development teams use Sigmetrix’ CETOL 6? tolerance analysis software to acquire the insights needed to confidently release designs to manufacturing. The new Optimus interface for CETOL 6? now enables them to evaluate the impact of assembly and component tolerances on product performance.

Optimus 10.17 now supports CST STUDIO SUITE and parallel execution of MSC Adams. With support for CST STUDIO SUITE, users can run parametric electromagnetic simulation without manual model changes and data process. Additionally, time design constraints imposed by manufacturing realities or stringent regulatory and standardization requirements, can be consistently taken into account.

Parallel execution of MSC Adams is done through Optimus Parallel Services. The software orchestrates the remote execution of inputs substitution, simulations and results extraction.

For more information, visit Noesis Solutions.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Materialise and Additive Industries Partner for Industrial 3D Printing Applications

Materialise and Additive Industries Partner for Industrial 3D Printing Applications

Materialise NV, a provider of additive manufacturing software and 3D printing solutions in the medical and industrial markets, has entered into a development partnership with Additive Industries, a Dutch company specializing in metal additive manufacturing equipment for industrial applications.

Materialise is building partnerships with machine manufacturers to bridge the gap between 3D software and a range of 3D printers. Additive Industries is a new player in the additive manufacturing market will offer a modular 3D metal printing system to industrial markets.

This month, Additive Industries’ team is launching its own integrated metal additive manufacturing system, the MetalFAB1. Equipped with automated build plate handling and in-line heat treatment, MetalFAB1 will premiere at FormNext, an international exhibition and conference on additive technologies and tool making. FormNext will take place between November 17-20 in Frankfurt am Main (D).

The partnership with Materialise is to develop a customized version of Build Processor software. The Additive Industries Build Processor is intended to simplify the 3D printing process for everyone with a MetalFAB1 machine. The software will facilitate the communication of data to the machine and will provide users with an overview of their print jobs. Its slicing algorithm can help users handle large design files.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

For more information, visit Additive Industries, Materialise andFormNext.

Fast Concept Modelling Simulation, TECOSIM Expand Collaboration

Fast Concept Modelling Simulation, TECOSIM Expand Collaboration

Fast Concept Modelling & Simulation (FCMS), a subsidiary of CONTACT software, has increased its collaboration with CAE specialist TECOSIM to develop a process solution for the mobility industry. According to the companies, this method speeds up the design process in the early concept phase and supports faster vehicle development.

The collaboration has created TEC|CONCEPT to help engineers analyze and reclaculate vehicle designs or individual model designs virtually.

TEC|CONCEPT allows diverse and complex requirements, such as quality, weight, stiffness and crash behavior, to be integrated early in the development process, a press release states. In addition, the possible impact of individual process-specific aspects, such as paintwork adhesion, deep drawability, casting and cost increases, can be taken into account during virtual recalculation. The CATIA-CAA-based Fast Concept Modeling (FCM) software is used for interdisciplinary harmonization between simulation and design engineering.

“Together, we can provide the mobility industry with a unique offering,” says Maximilian Zachries, general manager of FCMS GmbH. “TEC|CONCEPT enables companies to move more rapidly from the initial product idea to functionally validated model variants and concepts. This improves the productivity of their innovation processes and creates clear competitive advantages.”

For more information, visit FCMS.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Intersil Releases Time-of-Flight Integrated Circuit

Intersil Releases Time-of-Flight Integrated Circuit

Intersil Corporation, a provider of power management and precision analog solutions, has introduced a ToF (time-of-flight) signal processing IC (integrated circuit) that provides a complete object detection and distance measurement solution. The ISL29501 ToF offers ultra-small size, low power consumption and connectivity for such applications as Internet of Things devices, consumer mobiles and commercial drones.

The IC, according to Intersil, overcomes the challenges of traditional amplitude-based proximity sensors and other ToF that perform poorly in lighting conditions above 2,000 lux, or cannot always provide distance information. It also has an on-chip emitter DAC with programmable current up to 255mA and desired level selection for the infrared laser. This technology also uses the company’s power management expertise to save power and extend battery life, a press release states.

“Prior to Intersil’s time-of-flight technology breakthrough, there was no practical way to measure distance up to two meters in a small form factor,” said Andrew Cowell, senior vice president of Mobile Power Products at Intersil. “The innovative ISL29501 provides customers a cost-effective, small footprint solution that also gives them the flexibility to use multiple devices to increase the field of view to a full 360 degrees for enhanced object detection capabilities.”

For more information, visit Intersil.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Actran 16 Released

Actran 16 Released

Free Field Technologies has released Actran 16. The new version includes tools for performance in acoustic, vibro-acoustic and aeroacoustic simulations. Ease-of-use enhancements have also been added, the company states.

Acoustic propagations in huge domains and at high frequencies are now possible with Actran DGM code that supports GPU (graphics processing unit) acceleration.

For aeroacoustic capabilities, Actran 16 has the new SNGR module that synthesizes noise from inexpensive steady RANS solutions. Pellicular mode decomposition is also integrated for automotive side-window analysis and other acoustic contributions on non-rectangular and non-planar solutions.

The Actran time domain solver has been enhanced with solution capabilities and integration with MSC Software codes. Now, the software can read Dytran output files and has an updated interface with Adams.

Ease-of-use updates include several new tools for rapid creation and manipulation of vibro-acoustic meshes. Adaptive meshing technology has also been extended.

“Actran 16 delivers a valuable set of features to the industry,” said Benoit Van den Nieuwenhof, CTO at FFT. “The SNGR feature gives users access to new capabilities like full car exterior aero-acoustics where unsteady CFD computations are not affordable. For tackling higher frequencies and their associated model sizes, Actran features an original and automated mesh adaptivity. The Actran DGM solver leverages the latest HPC environments such as GP-GPUs which dramatically improves the computational efficiency of acoustic radiation analyses for automotive and aerospace industries”.

For more information, visit Free Field Technologies.

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